Our Core Competitiveness :
Surface Process: |
Delivery Time:
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Technology Capability: |
Carbon Ink |
Double Sides: 12-24 hours
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Min TG:2.5MIL/3MIL
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Peelable Soldernask
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4-8 Layers : 24-48 hours |
Micro via (laser drilling)
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Flash Gold, Hard Gold
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8-18 Layers : 72 hours |
Max finished Size: 1200*600mm
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OSP surface treatment
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More than 18 layers is up to difficulty.
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Blined/Buried hole,Countersink Hole
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PCBs with HAL, Lead free HASL,
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ROGERS,HIGH TG BOARD,Flexible Board,
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Half Hole,(Blinded hole,Buried Hole +HDI)
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Goled Finger, Immersion gole/tin/silver
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Blind Board,Buried Board,Bare Board...
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Plugged by Expoxy, Impedance..
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Welcome to make a field inspection of our factory.
Most respectfully,
Bjoy Tsang
Shenzhen JinShengDa Electronics& Technology Co.,Ltd
Factory Base: Building 12,LiSheng Industrial Area, TangWei,
Bao'an District,Shenzhen,Guangdong Province,P.R.China
Email: sales05@jsd-pcb.com
Website: http://www.jsdpcb.com/en
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